( December 19, 2025, 11:33 AM EST) -- WASHINGTON, D.C. — A Federal Circuit U.S. Court of Appeals panel on Dec. 18 dismissed for lack of jurisdiction a challenge to an Idaho federal judge’s decisions denying semiconductor manufacturing appellant entities’ motions to dismiss and imposing an $8 million bond under a state law targeting bad faith patent infringement, finding that the decisions were not appealable interlocutory orders....